Solder bump connections

US8778792B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Timothy H. Daubenspeck · Colchester, US
• Jeffrey P. Gambino · Gresham, US
• Ekta Misra · Hillsboro, US
• Christopher D. Muzzy · Burlington, US
• Wolfgang Sauter · Avon, US
• George J. Scott · Chandler, US

Key dates

• Filing date: Feb 4, 2013
• Grant date: Jul 15, 2014
• Expiry date: Feb 4, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Solder bump connections and methods for fabricating solder bump connections. The method includes forming a layer stack containing first and second conductive layers, forming a dielectric passivation layer on a top surface of the second conductive layer, and forming a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer. The method further includes forming a conductive plug in the via opening. The solder bump connection includes first and second conductive layers comprised of different conductors, a dielectric passivation layer on a top surface of the second conductive layer, a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer, and a conductive plug in the via opening.