Inventor · Hillsboro, OR, US

Ekta Misra

22Patents
4h-index
23Co-inventors
59Inventor score

Filing activity: Aug 18, 2005 → Jun 12, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US8937009B2 Far back end of the line metallization method and structures Electricity 6 Active
US8492892B2 Solder bump connections Electricity 4 Active
US8563416B2 Coaxial solder bump support structure Electricity 4 Active
US8298929B2 Offset solder vias, methods of manufacturing and design structures Emerging Cross-Sectional Technologies 4 Active
US9754905B1 Final passivation for wafer level warpage and ULK stress reduction Electricity 4 Active
US9159696B2 Plug via formation by patterned plating and polishing Electricity 4 Active
US10090271B1 Metal pad modification Electricity 3 Active
US8778792B2 Solder bump connections Electricity 3 Active
US7446037B2 Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance Electricity 3 Active
US8299581B2 Passivation layer extension to chip edge Electricity 3 Active
US7888263B2 Cladded silver and silver alloy metallization for improved adhesion electromigration resistance Electricity 2 Active
US8446006B2 Structures and methods to reduce maximum current density in a solder ball Electricity 2 Active
US10373925B2 Metal pad modification Electricity 1 Active
US9214385B2 Semiconductor device including passivation layer encapsulant Electricity 0 Active
US9842810B1 Tiled-stress-alleviating pad structure Electricity 0 Active
US9633962B2 Plug via formation with grid features in the passivation layer Electricity 0 Active
US10593639B2 Metal pad modification Electricity 0 Active
US9431359B2 Coaxial solder bump support structure Electricity 0 Active
US11756911B2 Metal pad modification Electricity 0 Active
US10622319B2 Final passivation for wafer level warpage and ULK stress reduction Electricity 0 Active
US8674506B2 Structures and methods to reduce maximum current density in a solder ball Electricity 0 Active
US10096557B2 Tiled-stress-alleviating pad structure Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.