George J. Scott
10Patents
3h-index
19Co-inventors
46Inventor score
Filing activity: Dec 17, 2009 → Aug 8, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8298929B2 | Offset solder vias, methods of manufacturing and design structures | Emerging Cross-Sectional Technologies | 4 | Active |
| US8563416B2 | Coaxial solder bump support structure | Electricity | 4 | Active |
| US8492892B2 | Solder bump connections | Electricity | 4 | Active |
| US8778792B2 | Solder bump connections | Electricity | 3 | Active |
| US8710656B2 | Redistribution layer (RDL) with variable offset bumps | Electricity | 3 | Active |
| US8446006B2 | Structures and methods to reduce maximum current density in a solder ball | Electricity | 2 | Active |
| US9062388B2 | Method and apparatus for controlling and monitoring the potential | Physics | 0 | Active |
| US9347147B2 | Method and apparatus for controlling and monitoring the potential | Physics | 0 | Active |
| US9431359B2 | Coaxial solder bump support structure | Electricity | 0 | Active |
| US8674506B2 | Structures and methods to reduce maximum current density in a solder ball | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.