Aperture control of thermal processing radiation
US8785815B2 · kind B2 · utility
4Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Nov 28, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70858
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Device for processing a substrate are described herein. Devices can include a radiation source and an aperture positioned to receive radiant energy from the radiation source. The aperture can include one or more members, and one or more interfering areas, wherein the interfering areas surround a transmissive area. The one or more structures can affect transmission of radiant energy through a portion of the transmissive area of the aperture. Structures disposed on the aperture can reduce or redirect transmission to provide for more uniform overall transmission of radiant energy through the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.