Process kit components for titanium sputtering chamber
US8790499B2 · kind B2 · utility
4Cited by
202References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2006 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Mar 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process kit for a sputtering chamber comprises a deposition ring, cover ring, and a shield assembly, for placement about a substrate support in a sputtering chamber. The deposition ring comprising an annular band with an inner lip extending transversely, a raised ridge substantially parallel to the substrate support, an inner open channel, and a ledge radially outward of the raised ridge. A cover ring at least partially covers the deposition ring, the cover ring comprising an annular plate comprising a footing which rests on a surface about the substrate support, and downwardly extending first and second cylindrical walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.