Adaptive patterning for panelized packaging
US8799845B2 · kind B2 · utility
15Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2010 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Sep 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.