Integrated circuit packaging system with island terminals and method of manufacture thereof
US8802501B2 · kind B2 · utility
2Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2011 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Apr 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.