Patent · US Active

Method for mounting a semiconductor chip on a carrier

US8802553B2 · kind B2 · utility

2Cited by

8References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Heinrich · Bad Abbach, DE
Konrad Roesl · Teublitz, DE
Oliver Eichinger · Regensburg, DE

Key dates

Filing date	Feb 10, 2011
Grant date	Aug 12, 2014
Priority date	—
Expiry date	May 17, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the layer of solder material has a roughness of at least 1 μm. The semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. The semiconductor chip is pressed on the carrier with a pressure of at least 1 Newton per mm2 of surface area of the first main surface and heat is applied to the solder material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.