Integrated circuit packaging system with protective coating and method of manufacture thereof
US8803300B2 · kind B2 · utility
4Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2010 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Jan 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.