Patent · US Active

Integrated circuit packaging devices and methods

US8810028B1 · kind B1 · utility

3Cited by

108References

15Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Nael Zohni · Campbell, US
Kumar Nagarajan · San Jose, US
Ronilo Boja · Gilroy, US

Key dates

Filing date	Jun 30, 2010
Grant date	Aug 19, 2014
Priority date	—
Expiry date	Sep 22, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Integrated circuit packaging devices and methods are disclosed. An embodiment package lid is formed from a single piece of material. The lid includes a planar rectangular main body having a bottom surface, and a leg disposed at each corner of the main body and within a perimeter of the main body. Each leg has a wall projecting downwardly from the main body and a non-planar bottom surface disposed at a bottom of the wall. The non-planar bottom surface of the leg faces a same direction as the main body bottom surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.