Device and method for loosening a polymer layer from a surface of a substrate
US8828147B2 · kind B2 · utility
0Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2011 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Mar 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a device for loosening a polymer layer from a surface of a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.