Patent · US Active

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

US8828798B2 · kind B2 · utility

3Cited by

23References

18Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Luke England · Boise, US
Paul A. Silvestri · Meridian, US
Michel Koopmans · Boise, US

Key dates

Filing date	Sep 17, 2013
Grant date	Sep 9, 2014
Priority date	—
Expiry date	Sep 17, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18161
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods of fabricating multi-die assemblies including a wafer segment having no integrated circuitry thereon and having a plurality of vertically stacked dice thereon electrically interconnected by conductive through vias, resulting multi-die assemblies, and semiconductor devices comprising such multi-die assemblies. The wafer segment may function as a heat sink to enhance heat transfer from the stacked dice in the resulting multi-die assembly. The die stacks are fabricated at the wafer level on a base wafer, from which the wafer segment and die stacks are singulated after at least peripheral encapsulation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.