Warp compensated package and method
US8829661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2006 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Aug 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10507
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts (36), opposed rear faces (33) and edges (32) therebetween. The devices (30) are mounted primary faces (31) down on a temporary support (60) in openings (44) in a warp control sheet (WCS) (40) attached to the support (60). Plastic encapsulation (50) is formed at least between lateral edges (32, 43) of the devices (30) and WCS openings (44). Undesirable panel warping (76) during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA (82) containing the devices (30) and the WCS (40) is separated from the temporary support (60) and, optionally, mounted on another carrier (70) with electrical contacts (36) exposed. Thin film insulators (85) and conductors (87) are desirably applied to couple electrical contacts (36) on various devices (30) to each other and to external terminals (88), thereby forming an integrated multi-device EPA (84).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.