Stackable semiconductor package with encapsulant and electrically conductive feed-through

US8829663B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Jens Pohl · San Luis Obispo, US
• Markus Brunnbauer · Lappersdorf, DE
• Irmgard Escher-Poeppel · Regensburg, DE
• Thorsten Meyer · Regensburg, DE

Key dates

• Filing date: Jul 2, 2007
• Grant date: Sep 9, 2014
• Expiry date: Nov 16, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A description is given of a device comprising a first semiconductor chip, a molding compound layer embedding the first semiconductor chip, a first electrically conductive layer applied to the molding compound layer, a through hole arranged in the molding compound layer, and a solder material filling the through hole.