Apparatus and method for cleaning semiconductor substrate using pressurized fluid
US8844546B2 · kind B2 · utility
9Cited by
11References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2008 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Feb 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.