Patent · US Active

Fluid cooled semiconductor die package

US8860212B1 · kind B1 · utility

7Cited by

5References

18Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Chee Seng Foong · Bandar Baru Sungai Buloh, MY
Tim V. Pham · Austin, US

Key dates

Filing date	Apr 15, 2013
Grant date	Oct 14, 2014
Priority date	—
Expiry date	Apr 15, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/167
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A fluid cooled semiconductor die package includes a package support substrate with a die mounting surface and an opposite package mounting surface. The package support substrate has external connector solder deposits on respective external connector pads of the package mounting surface, and a package fluid inlet duct and a package fluid outlet duct each providing fluid communication between the die mounting surface and package mounting surface. A semiconductor die is mounted on the die mounting surface. The die has external terminals electrically connected to the external connector pads. An inlet solder deposit is soldered to an inlet pad of the package mounting surface. The inlet pad surrounds an entrance of the fluid inlet duct. An outlet solder deposit is soldered to an outlet pad of the package mounting surface. The outlet pad surrounds an exit of the package fluid inlet duct.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.