Wafer encapsulated microelectromechanical structure and method of manufacturing same
US8871551B2 · kind B2 · utility
16Cited by
220References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2006 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Aug 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.