Patent · US Active

Balancing RF bridge assembly

US8875657B2 · kind B2 · utility

1Cited by

2References

17Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Jonghoon Baek · San Jose, US
Sam Kim · Chandler, US
Beom Soo Park · San Jose, US

Key dates

Filing date	Jan 26, 2011
Grant date	Nov 4, 2014
Priority date	—
Expiry date	Sep 6, 2033

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/505
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Embodiments disclosed herein generally relate to a PECVD apparatus. When the RF power source is coupled to the electrode at multiple locations, the current and voltage may be different at the multiple locations. In order to ensure that both the current and voltage are substantially identical at the multiple locations, an RF bridge assembly may be coupled between the multiple locations at a location just before connection to the electrode. The RF bridge assembly substantially equalizes the voltage distribution and current distribution between multiple locations. Therefore, a substantially identical current and voltage is applied to the electrode at the multiple locations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.