Methods of producing structures using a developer-soluble layer with multilayer technology
US8877430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2011 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Jul 6, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods of forming microelectronic structures using multilayer processes are disclosed. The methods comprise the use of a developer-soluble protective layer adjacent the substrate surface in a multilayer stack to protect the substrate during pattern transfer. After etching, the pattern is transferred into the developer-soluble protective layer using a developer instead of etching required by previous methods. Conventional developer-soluble anti-reflective coatings and gap-fill materials can be used to form the protective layer. Custom layers with developer solubility can also be prepared. Microelectronic structures formed by the above processes are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.