Methods and apparatus for processing substrates using model-based control

US8880210B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Keith Brian Porthouse · Sunnyvale, US
• John W. Lane · Austin, US
• Mariusch Gregor · Gilroy, US
• Nir Merry · Mountain View, US
• Michael R. Rice · Pleasanton, US
• Alex Minkovich · Campbell, US
• Hongbin Li · Shanghai, CN
• Dmitry A. Dzilno · Sunnyvale, US

Key dates

• Filing date: Jul 15, 2011
• Grant date: Nov 4, 2014
• Expiry date: Jan 16, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67253
• WIPO field: Control
• WIPO sector: Instruments

Abstract

Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state.