Inspection method and apparatus and lithographic processing cell
US8887107B2 · kind B2 · utility
2Cited by
5References
18Claims
0Family size
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Key dates
| Filing date | Aug 9, 2013 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Aug 9, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.