Delamination drying apparatus and method
US8898928B2 · kind B2 · utility
12Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2012 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Apr 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.