Substrate processing sequence in a cartesian robot cluster tool

US8911193B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Mike Rice · Pleasanton, US
• Jeffrey C. Hudgens · San Francisco, US
• Charles T. Carlson · Cedar Park, US
• William T. Weaver · Austin, US
• Robert B. Lowrance · Los Gatos, US
• Eric A. Englhardt · Palo Alto, US
• Dean C. Hruzek · Cedar Park, US
• Dave Silvetti · معلمی نژاد, US
• Michael Kuchar · Georgetown, US
• Kirk Van Katwyk · Tracy, US
• Van Hoskins · Round Rock, US
• Vinay Shah · San Mateo, US

Key dates

• Filing date: Nov 28, 2011
• Grant date: Dec 16, 2014
• Expiry date: Nov 28, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S414/135
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.