Patent · US Active

Polishing pad with alignment aperture

US8920219B2 · kind B2 · utility

8Cited by
7References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 15, 2011
Grant dateDec 30, 2014
Priority date—
Expiry dateApr 17, 2033

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24D18/0009
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.