Methods and apparatus for thermal based substrate processing with variable temperature capability

US8920564B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Gwo-Chuan Tzu · Sunnyvale, US
• Xiaoxiong Yuan · Cupertino, US
• Amit Khandelwal · Cupertino, US
• Benjamin C. Wang · Santa Clara, US
• Avgerinos V. Gelatos · Scotts Valley, US
• Kai Wu · Palo Alto, US
• Michael P. Karazim · San Jose, US
• Jing-Chie Lin · Mountain View, US
• Olkan Cuvalci · Sunnyvale, US

Key dates

• Filing date: Jun 27, 2011
• Grant date: Dec 30, 2014
• Expiry date: Mar 19, 2033

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/52
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.