Amit Khandelwal
19Patents
8h-index
44Co-inventors
64Inventor score
Filing activity: Dec 10, 2004 → Oct 31, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7964505B2 | Atomic layer deposition of tungsten materials | Electricity | 150 | Active |
| US7405158B2 | Methods for depositing tungsten layers employing atomic layer deposition techniques | Electricity | 87 | Expired |
| US7429402B2 | Ruthenium as an underlayer for tungsten film deposition | Emerging Cross-Sectional Technologies | 81 | Active |
| US7732327B2 | Vapor deposition of tungsten materials | Electricity | 48 | Active |
| US7745333B2 | Methods for depositing tungsten layers employing atomic layer deposition techniques | Electricity | 38 | Active |
| US8071478B2 | Method of depositing tungsten film with reduced resistivity and improved surface morphology | Electricity | 36 | Active |
| US7691442B2 | Ruthenium or cobalt as an underlayer for tungsten film deposition | Emerging Cross-Sectional Technologies | 34 | Active |
| US7514353B2 | Contact metallization scheme using a barrier layer over a silicide layer | Electricity | 25 | Active |
| US7521379B2 | Deposition and densification process for titanium nitride barrier layers | Electricity | 8 | Active |
| US8187970B2 | Process for forming cobalt and cobalt silicide materials in tungsten contact applications | Electricity | 7 | Active |
| US8563424B2 | Process for forming cobalt and cobalt silicide materials in tungsten contact applications | Electricity | 6 | Active |
| US8551880B2 | Ammonia-based plasma treatment for metal fill in narrow features | Electricity | 5 | Active |
| US7838441B2 | Deposition and densification process for titanium nitride barrier layers | Electricity | 4 | Active |
| US9275865B2 | Plasma treatment of film for impurity removal | Electricity | 2 | Active |
| US8920564B2 | Methods and apparatus for thermal based substrate processing with variable temperature capability | Chemistry; Metallurgy | 2 | Active |
| US8513116B2 | Atomic layer deposition of tungsten materials | Electricity | 2 | Active |
| US8211799B2 | Atomic layer deposition of tungsten materials | Electricity | 1 | Active |
| US9783889B2 | Apparatus for variable substrate temperature control | Chemistry; Metallurgy | 1 | Active |
| US9546419B2 | Method of reducing tungsten film roughness and resistivity | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.