Patent · US Active

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

US8937309B2 · kind B2 · utility

47Cited by

24References

13Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Luke England · Boise, US
Paul A. Silvestri · Meridian, US
Michel Koopmans · Boise, US

Key dates

Filing date	Aug 8, 2011
Grant date	Jan 20, 2015
Priority date	—
Expiry date	Aug 8, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12042
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods of fabricating multi-die assemblies including a base semiconductor die bearing a peripherally encapsulated stack of semiconductor dice of lesser lateral dimensions, the dice vertically connected by conductive elements between the dice, resulting assemblies, and semiconductor devices comprising such assemblies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.