Method of diced wafer transportation
US8940619B2 · kind B2 · utility
3Cited by
54References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2013 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Jun 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of dicing semiconductor wafers, and transporting singulated die, are described. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. The method also involves forming a water soluble material layer over and between the plurality of singulated dies, above the dicing tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.