Semiconductor device and manufacturing method thereof
US8941244B1 · kind B1 · utility
7Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2013 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Jul 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure includes a molding compound, a conductive plug, and a cover. The conductive plug is in the molding compound. The cover is over a top meeting joint between the conductive plug and the molding compound. The semiconductor structure further has a dielectric. The dielectric is on the cover and the molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.