Integrated circuit packaging system with embedded circuitry and post
US8957530B2 · kind B2 · utility
6Cited by
36References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2011 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Apr 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.