Sputtering target having increased life and sputtering uniformity
US8968536B2 · kind B2 · utility
2Cited by
180References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2007 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Jan 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L69/28
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A sputtering target for a sputtering chamber comprises a backing plate with a sputtering plate mounted thereon. In one version, the backing plate comprises a circular plate having a front surface comprising an annular groove. The sputtering plate comprises a disk comprising a sputtering surface and a backside surface having a circular ridge that is shaped and sized to fit into the annular groove of the backing plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.