Point of use valve manifold for semiconductor fabrication equipment
US8985152B2 · kind B2 · utility
4Cited by
4References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Jun 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A point-of-use valve (POU valve) manifold is provided that allows for multiple precursors to be delivered to a semiconductor processing chamber through a common outlet. The manifold may have a plurality of precursor inlets and a purge gas inlet. The manifold may be configured such that there are zero dead legs in the manifold when the purge gas is routed through the manifold, and may provide mounting location for the POU valves that alternate sides. One or more internal flow path volumes may include elbow features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.