Patent · US Active

Ion implanter and ion implant method thereof

US8987691B2 · kind B2 · utility

0Cited by
11References
27Claims
0Family size

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Key dates

Filing dateJan 21, 2013
Grant dateMar 24, 2015
Priority date
Expiry dateJan 21, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/30488
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An ion implanter and an ion implant method are disclosed. Essentially, the wafer is moved along one direction and an aperture mechanism having an aperture is moved along another direction, so that the projected area of an ion beam filtered by the aperture is two-dimensionally scanned over the wafer. Thus, the required hardware and/or operation to move the wafer may be simplified. Further, when a ribbon ion beam is provided, the shape/size of the aperture may be similar to the size/shape of a traditional spot beam, so that a traditional two-dimensional scan may be achieved. Optionally, the ion beam path may be fixed without scanning the ion beam when the ion beam is to be implanted into the wafer, also the area of the aperture may be adjustable during a period of moving the aperture across the ion beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.