Interconnect structures with polymer core

US8987918B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Sandeep Razdan · Burlingame, US
• Edward R. Prack · Phoenix, US
• Sairam Agraharam · Chandler, US
• Robert L. Sankman · Phoenix, US
• Shan Zhong · Clarksville, US
• Robert M. Nickerson · Chandler, US

Key dates

• Filing date: Mar 14, 2013
• Grant date: Mar 24, 2015
• Expiry date: Mar 14, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.