Mask assignment optimization
US9003336B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Mar 1, 2013 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Mar 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76816
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for optimizing mask assignment for multiple pattern processes includes, through a computing system, defining which of a number of vias to be formed between two metal layers are critical based on metal lines interacting with the vias, determining overlay control errors for an alignment tree that defines mask alignment for formation of the two metal layers and the vias, and setting both the alignment tree and mask assignment for the vias so as to maximize the placement of critical vias on masks that have less overlay control error to the masks forming the relevant metal lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.