Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps
US9006031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2011 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jan 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a carrier with a die attach area. Recesses are formed partially through the carrier outside the die attach area. A first conductive layer is conformally applied over a surface of the carrier and into the recesses. A semiconductor die is mounted to the die attach area of the carrier. An encapsulant is deposited over the carrier and semiconductor die. The encapsulant extends into the recesses over the first conductive layer to form encapsulant bumps. The carrier is removed to expose the first conductive layer over the encapsulant bumps. A first insulating layer is formed over the semiconductor die with openings to expose contact pads of the semiconductor die. A second conductive layer is formed between the first conductive layer and the contact pads on the semiconductor die. A second insulating layer is formed over the second conductive layer and semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.