Process feed management for semiconductor substrate processing

US9017481B1 · kind B1 · utility

Assignee

• ASM America, Inc. · US

Inventors

• Fred Pettinger · Phoenix, US
• Carl Louis White · Gilbert, US
• Dave Marquardt · Gilbert, US
• Sokol Ibrani · Pleasanton, US
• Eric James Shero · Phoenix, US
• Todd Robert Dunn · Cave Creek, US
• Kyle Fondurulia · Phoenix, US
• Mike Halpin · Phoenix, US

Key dates

• Filing date: Oct 28, 2011
• Grant date: Apr 28, 2015
• Expiry date: Jan 22, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/32532
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.