Patent · US Active

Load lock chamber designs for high-throughput processing system

US9022715B2 · kind B2 · utility

1Cited by
5References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 17, 2013
Grant dateMay 5, 2015
Priority date
Expiry dateSep 17, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67201
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Methods and apparatus for transferring one or more substrates from a first pressure environment to a second pressure environment is provided. In one embodiment, a load lock chamber is provided. The load lock chamber comprises a first circular housing, and a second circular housing disposed within and movable relative to the first circular housing, one of the first circular housing or the second circular housing comprising a plurality of discrete regions, wherein at least a portion of the plurality of discrete regions are in selective fluid communication with one of at least two vacuum pumps based on the angular position of the second circular housing relative to the first circular housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.