Polishing pad for eddy current end-point detection
US9028302B2 · kind B2 · utility
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45References
10Claims
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Key dates
| Filing date | Dec 6, 2013 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Dec 6, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.