Patent · US Active

Method for mounting a semiconductor chip on a carrier

US9034751B2 · kind B2 · utility

1Cited by

9References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Heinrich · Bad Abbach, DE
Konrad Roesl · Teublitz, DE
Oliver Eichinger · Regensburg, DE

Key dates

Filing date	Jul 18, 2014
Grant date	May 19, 2015
Priority date	—
Expiry date	Jul 18, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the layer of solder material has a roughness of at least 1 μm. The semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. The semiconductor chip is pressed on the carrier with a pressure of at least 1 Newton per mm2 of surface area of the first main surface and heat is applied to the solder material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.