Semiconductor including cup-shaped leadframe packaging techniques
US9040356B2 · kind B2 · utility
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19References
24Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 19, 2009 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Jun 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.