Mohammed Kasem
10Patents
4h-index
23Co-inventors
56Inventor score
Filing activity: Jun 12, 2001 → Apr 5, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7394150B2 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys | Electricity | 24 | Expired |
| US7238551B2 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys | Electricity | 22 | Expired |
| US8471381B2 | Complete power management system implemented in a single surface mount package | Electricity | 8 | Active |
| US6858471B1 | Semiconductor substrate with trenches for reducing substrate resistance | Electricity | 6 | Expired |
| US8928138B2 | Complete power management system implemented in a single surface mount package | Electricity | 2 | Active |
| US9306056B2 | Semiconductor device with trench-like feed-throughs | Electricity | 2 | Active |
| US9093359B2 | Complete power management system implemented in a single surface mount package | Electricity | 1 | Active |
| US6414362B1 | Power semiconductor device | Electricity | 0 | Expired |
| US9040356B2 | Semiconductor including cup-shaped leadframe packaging techniques | Electricity | 0 | Active |
| US10032901B2 | Semiconductor device with trench-like feed-throughs | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.