Vishay-Siliconix, LLC
130Patents
112Active
130Granted
54Portfolio score
Filing activity: Jul 17, 2001 → Dec 23, 2021 · 38 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7005347B1 | Structures of and methods of fabricating trench-gated MIS devices | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6906380B1 | Drain side gate trench metal-oxide-semiconductor field effect transistor | Electricity | 43 | Expired |
| US7335946B1 | Structures of and methods of fabricating trench-gated MIS devices | Emerging Cross-Sectional Technologies | 33 | Expired |
| US9589929B2 | Method for fabricating stack die package | Electricity | 22 | Active |
| US7544545B2 | Trench polysilicon diode | Electricity | 20 | Active |
| US7344945B1 | Method of manufacturing a drain side gate trench metal-oxide-semiconductor field effect transistor | Electricity | 19 | Expired |
| US7279743B2 | Closed cell trench metal-oxide-semiconductor field effect transistor | Electricity | 18 | Expired |
| US8080459B2 | Self aligned contact in a semiconductor device and method of fabricating the same | Electricity | 18 | Active |
| US8822273B2 | Dual lead frame semiconductor package and method of manufacture | Electricity | 18 | Active |
| US8367500B1 | Method of forming self aligned contacts for a power MOSFET | Electricity | 17 | Expired |
| US7868381B1 | Structures of and methods of fabricating trench-gated MIS devices | Emerging Cross-Sectional Technologies | 17 | Active |
| US8629019B2 | Method of forming self aligned contacts for a power MOSFET | Electricity | 16 | Expired |
| US7833863B1 | Method of manufacturing a closed cell trench MOSFET | Electricity | 16 | Active |
| US6552889B1 | Current limiting technique for hybrid power MOSFET circuits | Electricity | 16 | Expired |
| US7361558B2 | Method of manufacturing a closed cell trench MOSFET | Electricity | 15 | Expired |
| US7494876B1 | Trench-gated MIS device having thick polysilicon insulation layer at trench bottom and method of fabricating the same | Electricity | 14 | Expired |
| US9431249B2 | Edge termination for super junction MOSFET devices | Electricity | 13 | Active |
| US9425304B2 | Transistor structure with improved unclamped inductive switching immunity | Electricity | 12 | Active |
| US9437424B2 | High mobility power metal-oxide semiconductor field-effect transistors | Electricity | 10 | Active |
| US8582258B1 | Electrostatic discharge protection circuit for integrated circuits | Electricity | 10 | Active |
| US9443974B2 | Super junction trench power MOSFET device fabrication | Electricity | 10 | Active |
| US8368126B2 | Trench metal oxide semiconductor with recessed trench material and remote contacts | Electricity | 10 | Active |
| US9425306B2 | Super junction trench power MOSFET devices | Electricity | 9 | Active |
| US7211877B1 | Chip scale surface mount package for semiconductor device and process of fabricating the same | Electricity | 9 | Expired |
| US7151036B1 | Precision high-frequency capacitor formed on semiconductor substrate | Emerging Cross-Sectional Technologies | 9 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.