Integrated circuit packaging system with redistribution layer and method of manufacture thereof
US9054098B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2011 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | May 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral interconnect having a bond finger and a contact pad with a trace in direct contact with the bond finger and the contact pad, the bond finger vertically offset from the contact pad; connecting an integrated circuit die and the bond finger; and forming a module encapsulation on the integrated circuit die, the bond finger and the trace exposed from the module encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.