Heat dissipating semiconductor device packages and related methods
US9054118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2014 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Jun 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of a method for making semiconductor device packages includes a heat sink matrix and a substrate. A plurality of semiconductor devices is attached to the substrate. Then, a package body is formed between the heat sink matrix and the substrate, wherein the package body encapsulates the semiconductor devices. Then, a plurality of first cutting slots is formed, wherein the first cutting slots extend through the heat sink matrix and partially extend into the package body. Then, a plurality of second cutting slots is formed, wherein the second cutting slots extend through the substrate and through the package body to the first cutting slot, thereby singulating the heat sink matrix and substrate into a plurality of individual semiconductor device packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.