Patent · US Active

Chip edge sealing

US9054150B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Zundel · Egmating, DE
Gabriela Brase · Fishkill, US
Peter Nelle · Munich, DE
Guenther Schindler · Hersbruck, DE

Key dates

Filing date	Sep 20, 2013
Grant date	Jun 9, 2015
Priority date	—
Expiry date	Sep 20, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH10D64/117
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a semiconductor component comprising a semiconductor body, an insulation on the semiconductor body and a cell array arranged at least partly within the semiconductor body. The cell array has at least one p-n junction and at least one contact connection. The insulation is bounded in lateral direction of the semiconductor body by a circumferential diffusion barrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.