Aqueous cleaner for the removal of post-etch residues
US9063431B2 · kind B2 · utility
17Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2011 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Aug 12, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.