Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface
US9070536B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2012 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Oct 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32724
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Undesirable heating of a semiconductor process ring is prevented by thermally isolating the process ring from the insulating puck of an electrostatic chuck, and providing a thermally conductive and electrically insulating thermal ring contacting both the semiconductor process ring and an underlying metal base having internal coolant flow passages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.