Microelectronic assembly having a heat spreader for a plurality of die
US9070653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2013 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Mar 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly (100) and a microelectronic device (4100) include a stacked structure (101). The stacked structure includes a heat spreader (104), at least one die (106) thermally coupled to at least a portion of one side of the heat spreader, at least one other die (108) thermal coupled to at least a portion of an opposite side of the heat spreader, at least one opening (401) in the heat spreader located in a region of between the two die, an insulator (603) disposed in the at least one opening, and electrically conductive material (1308, 1406) in an insulated hole (705) in the insulator. The heat spreader allows electrical communication between the two die through the opening while the insulator isolates the electrically conductive material and the heat spreader from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.