Copper cleaning and protection formulations
US9074170B2 · kind B2 · utility
20Cited by
51References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2009 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Feb 3, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.